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Unlike traditional fiberglass cloth with low thermal conductivity of the ceramic powder filler content .HP2000 using high filler load and 30um thin glass fiber composites. Even high surface flatness can be achieved using low pressure and low contact resistance. Recommended for use in other parts need insulation TO220/TO3P.
Product overview
"Thermal Conductivity Fiberglass Reinforcement HP2000"
* Low Thermal Contact Resistance.
* Exceptional Thermal
* Performance At Lower Application Pressures (20psi～400psi).
* Usable Over a Wide Temperature Range.
* Simplified Processing and Reduced Operating Costs.
Product specifications
| Model | HP2000 | Unit | Test mehod |
|---|---|---|---|
| Carrier material | Fiberglass |
－ | － |
| Exterior color | Pink | -------- | Visual |
| Product Thickness | 0.2~0.5 |
mm | ASTM D374 |
| Thermal Conductivity | 1.5 |
W/m-k | ASTMD5470 |
| Specific Gravity | 2.7 |
g/cm3 |
ASTM D792 |
| Extension rate | <10 |
% | ASTMD412 |
| Tensile Strength | >21 |
Kgf/c㎡ | ASTMD412 |
| Hardness | 75 |
Shore A | ASTM D2240 |
| Volume Resistivity | >1013 |
Ωcm |
ASTMD257 |
| Insulation Strength | >3.5 |
KV | ASTM D149 |
| Continuous Use Temperature | -50~220 |
℃ | --- |
| Thermal Impedance | 0.28 |
℃-in2/W |
ASTM D5470 |
| Dielectric Constant | 7 |
1 | ---- |
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