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characteristic:
※Light weight.
※The contact air is large.
※High thermal conductivity.
※The surface resistance is high.
※High withstand voltage value.
Product overview
*Application range
High-power transistors, power modules, processors, semiconductors, printed circuit boards, etc.
General product list:
| Flat type(T2~10mm) | 10*10*T2.0 ｜ 20*20*T2.0 ｜60*60*T2.0｜50*50*T2.0 25*25*T2.0 ｜ 30*30*T2.0 ｜35*35*T2.0｜40*40*T2.0 100*100*T2.0｜20*15*T5.0(hole) |
| Bump type(T3~10mm) | 25*25*T3.0 ｜ 25*25*T5.0 |
| Wave type(T5.0~10mm) | 20*15*T5.0 ｜ 25*25*T5.0 ｜30*30*T5.0 ｜35*35*T5.0 40*40*T5.0 |
Product specifications
| Model | CH-22 | Unit | Test mehod |
|---|---|---|---|
| Product Thickness | Multiple thickness |
mm | ASTM D374 |
| Thermal Conductivity | 7.2 |
W/m-k | ASTMD5470 |
| Specific Gravity | 1.85±0.2 |
g/cm3 |
ASTM D792 |
| Coefficient of Thermal Expansion | 4.1 |
ppm/K |
－ |
| Hardness | 5±1 |
Shore A | ASTM D2240 |
| Insulation Strength | > 5 |
KV | ASTM D149 |
| Continuous Use Temperature | < 500 |
℃ | --- |
| Surface Resistance | > 110 |
ohm |
ASTM D257 |
| Flexural Strength | 48 |
Kgf/cm2 |
CNS12701 |
| Porosity | 30 |
% |
CNS619 |
| Main ingredient | Sic/Sio2 |
－ |
－ |
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